- Innovative soldering free process, environmental friendly.
- Duo high conductive heat pipes operating with high density heat-dissipating area to boost cooling performance!
- Patent twin towers rotary heat sinks to avoid interference with other components
- Universal clips design, compatible with all mainstream mainboards and easy to install.
- Zero dBA and Value-saving! No need to purchase extra fan, rapid heat dissipating only by natural convection in chassis.
|Material||Aluminum Fin + Copper Base|
|Heat Pipes||Copper Ø8mmx1 & Ø5mm x1|
|Applicable Mainboards||Intel LGA775; AMD 939/940/AM2|