Zaward Twin Towers
Specifications
Features
- Innovative soldering free process, environmental friendly.
- Duo high conductive heat pipes operating with high density heat-dissipating area to boost cooling performance!
- Patent twin towers rotary heat sinks to avoid interference with other components
- Universal clips design, compatible with all mainstream mainboards and easy to install.
- Zero dBA and Value-saving! No need to purchase extra fan, rapid heat dissipating only by natural convection in chassis.
Specifications
| Dimension | 65.8x35x120mm±1 (LxWxH) |
| Weight | 120g±20 |
| Base Dimension | Ø37x2mm |
| Material | Aluminum Fin + Copper Base |
| Heat Pipes | Copper Ø8mmx1 & Ø5mm x1 |
| Noise Level | 0dBA |
| Applicable Mainboards | Intel LGA775; AMD 939/940/AM2 |






















































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